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BTB080040-M2S11203  0.80mm double
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  • BTB080040-M2S11203  0.80mm double

BTB080040-M2S11203 0.80mm double

Mating Cycle : 50 Cycles ISO9001 and ISO14001 Certification Product compliant to ROHS and Lead free Reflow solder capable to 260 degree Low profile connector design with fine pitch Double contact points ensure enhanced contact stability Lead time: 2-3 weeks

  • Product Introduction
  • 参数
  • Product Name :

    BTB080040-M2S11203 0.80mm double contact Board-to-Board 2*20P Male Connector Mated Height=5.2mm

     

    Key words: We supply SlimStack Board-to-Board/ 0.8mm pitch 6Pin Board-to-FPC Connectors /
    Board to Board Pitch 0.8mm Male Type Connector/ Circular Connector Pcb Board To Board Female Header 0.8mm Pitch/ Surface Mount Smt Type Board To Board Male Plug Connector   , We exported to customers all over the world .

    Products are widely used on c computer and peripheral products, digital electronic products, communication electronic products, automobile electronic products, banking terminal electronic products, medical electronic products and home appliances electronic products, etc.   

     

    We strictly in accordance with the ISO9001/ISOI14001 quality management system standards for quality control. we are expecting become your long-term partner in china.

     

    Product Specification:

    Insulator

    Lcp black UL94V-0

    Plating of the connector

    Phosphor Bronze, Tin 100U" At solder tail

    Selectived gold on contact area plating.

    Ground of micro sd card

    Phonsphor Bronze

    Operating Voltage

    60V AC/DC

    Current rating

    0.5A/Pin

    Dielectric withstanding voltage

    500V AC

    Operating Temperature

    -25--+85 degree

    Humidity range

    95% R.H Max

    Insulation resistance

    800 Ω minimum at 250 VDC

    Contact Retention Force

    100gf Min Per Contact

    Rate voltage

    50V

    Contact Resistance

    60  MAX

    Mating Cycles

    50 Cycles

    Target Markets & Applications

    • IP Phone
    • Telecom/Datacom equipment
    • High End Computers
    • Router   Servers
    • Test Card and Card Extenders
    • Test and Measurement Equipment     

    Products feature

    1. Long-time life cycle (more than 30 times);
    2. High temperature resistance;
    3. Commonly used models;

    Standard packing quantity

    5000pcs

    MOQ

    5000pcs

    Lead time

    2 weeks

     

    Company advantages:

    • We are manufacturer ,with about 20 years experiences in electronic connector field , there are about 500 staff in our factory now.
    • From designing of the products,--tooling-- Injection - Punching - Plating - Assembly - QC Inspection-Packing - Shipment, we finished all the process in our factory except plating .So we can well control the quality of the goods.We can also customized some special products for customers.
    • Fast respond. From sales person to QC and R&D engineer ,if customers have any problems, we can reply customer at first time.
    • Variety of products: Card connectors/FPC Connectors/Usb connectors/ wire to board connectors /board to board connectors /hdmi connectors/rf connectors /battery connectors ...

     

    Why Choose Us:

    • Free Samples
    • Quick Response
    • Technical Support
    • Product Customization
    • Fast Delivery
    • Quality Control

     

    Packing details :

    Products are packed with reel & tape packing ,with vacuum packing ,outer packing is in cartons .

     

    Shipping Details :

    We choose DHL/ UPS/FEDEX/TNT international shipping companies to ship the goods .

    • Material

      • housing
      • orbit
      • Terminal
      • Shell
      • Insulator
      • Contacts
      • Ground
      • color
      • contact
      • Contact Area
      • Shell
      • Cover
      • SHELL COVER
      • Solder tab
      • clip
      • Underplate
      • Solder tails
      • MID PLATE
      • LEG
      • Actuator
      • Metal Tab
      • Lock
      • PEG
      • Fitting nail
      • HSG
      • Shielding
      • Led1
      • Led2
      • Insert
      • Slider
      • POWER PIN
      • GROUND PIN
      • SIGNAL PIN
      • MYLAR
      • Finish
      • Applicable Wires
      • Suction cap
      • Q'TY/Reel
      • Solder_Tab
      • Plating
      • Wafer
      • Pin
      • Suitable
      • Contact Material
      • Insulator Material
      • Pin MATERIAL
    • Electrical Characteristics

      • Operating voltage
      • Current rating
      • Operating Temperature
      • Insulation resistance
      • Dielectric withstanding voltage
      • Contact resistance
      • Voltage Current rating
      • Voltage rating
      • Insulation Resistance
      • Contact Material
      • Shell
      • Housing
      • CONTACT CURRENT RATING
      • LOW LEVEL CONTACT RESISTANCE
      • Contact Mateed rial
      • Insulator Material
      • plating
      • Withstanding voltage
      • Working Temperature
      • Storage Temperature
    • Mechanical characteristics

      • Mating durability
      • Insertion force
      • Extraction force
      • Mating cycle
      • Rating current
      • Insulation resistance
      • Terminal contact resistance
      • Withstanding voltage
      • Durability Cycles
      • FREQUENCY
      • UNMATING FORCE
      • MATING FORCE
      • DURABILITY(MATING CYCLES)
      • CONTACT RETENTION FORCE
    • Environment performance

      • Operating temperature
      • Storage temperature
      • OPERATING TEMPERATURE RANGE
      • Temperature range
      • Humidity range
    • Environmental Characteristics

      • Operating temperature
      • Operating humidity
      • Storage temperature
      • Storage humidity
      • Thermal shock
      • Damp heat
      • Salt-mist
    • General characteristics

      • Contact principle
      • Operating position
      • Mounting System
      • Durability
    • Mechanical characteristics

      • Insulation material
    • Electrical Characteristics

      • Number of contacts(Optional)
      • Contact resistance
      • Insulation resistance
    • Solder ability

      • Wave
      • Vaporphase
      • IR reflow
      • Manual soldering
    • PLATED

      • SHELL
      • CONTACT
    • SPECIFICATION NOTES

      • CONTACT RESISTANCE
      • CURRENT RATING
      • VOLTAGE RATING
      • DIELECTRIC WITHSTANDING VOLTAGE
    • SPECIALITY

      • Rated Current
      • Rated Voltage
      • Ambient Temperature Range
      • storageTemperature Range
      • Ambient Humidity Range
      • Contact Resistance
      • Insulation Resistance
      • Dielectric Withstanding Voltage
      • Durability
    • Electrical

      • Voltage Rating
      • Current Rating
      • Operating Temperature
      • Insulation Resistance
      • Contact Resistance
      • Durability
      • Insulation Resistance
      • Withstanding Voltage
      • Rated Current
      • Rated Voltage
      • Ambient Temperature Range
      • Ambient Humidity Range
      • Dielectric Withstanding Voltage
      • Durability
      • CURRENT
      • VOLTAGE
      • Total Mating Force
      • Total Unmating force
      • temperature Rage
      • Contact current rating
      • Contact rated voltage
      • Withstanding strength
      • Dielectric strength
    • Plating

      • Contact area
      • Solder area
      • Underplating
      • Cover Underplating
      • Cover Solder area
      • Shell
      • Contact
      • Contacts
      • LEG
      • Metal Tab
      • POWER PIN&SIGNAL PIN&GROUND PIN
    • Specification

      • Current Rating
      • Contact Resistance
      • Insulation Resistance
      • Dielectric Withstanding Voltage
      • Operating Temperature
      • Mating Cycles
      • Voltage Rating
      • Current
      • Withstanding Voltage
      • Temperature Range
      • Life
      • VOLTAGE
      • INSERTION FORCE
      • UNMATING FORCE
      • DURABILITY
      • Terminal contact resistance
    • Main Performance

      • Rated current
      • Rated voltage
      • Contact resistance
      • Insulation resistance
      • Withstanding voltage test
      • Solderability
      • Durability
      • Operating environment
      • humidity
    • Plating of Contact

      • CONTACT
      • SHELL
      • Terminal
      • solder tab
      • Fitting Nail
    • Mechanical performance

      • Mating Cycles
      • Durability
      • Normal force
      • INSERTION FORCE
      • EXTRACTION FORCE
      • DURABILITY
      • REMOVAL FORCE
      • Insertion and extraction force
      • Durability
    • Electrical performance

      • Rating current
      • Insulation resistance
      • Terminal contact resistance
      • Withstanding voltage
      • Contact Resistance
      • Dielectric Withstanding Voltage
      • CURRENT RATING
      • VOLTAGE RATING
      • VBUS & GND PINS AND OTHER PINS
      • SHIELD
      • LLCR MAX. CHANGE OF ALL PINS
      • OPERATING TEMPERATURE
      • RATED VOLTAGE
      • WITHSTAND VOLTAGE
      • APPLICABLE WIRE RANGE
      • TEMPERAURE RANGE
    • FINISH

      • CONTACT
      • SHELL
      • Shell Au
      • Terminal
      • Solder Tab
      • UNDERPLATING
      • FINISH
      • FITTING NAIL
    • ELECTRICAL CHARACTERISTICS

      • OPERATING VOLTAGE
      • CURRENT RATING
      • OPERATING TEMPERATURE
      • CONTACT RESISTANCE
      • INSULATION RESISTANCE
      • DIELECTRIC WITHSTANDING VOLTAGE
    • Mechanical

      • Shell push pull force
      • Durability
      • Withdrawal force
      • Insertion force
      • MATING
      • WITHDRAWAL
      • Mate Force
      • Unmate Force
      • Terminal Retention
      • Mating Cycles
      • Average Insertion force with steel pin ofφ0.432
      • Average withdrawal force with steel pin of ≠0.432
      • Mechanical lige
      • Operaling temperature
    • Environment characteristics

      • Operating Temperature
      • Insertion force
      • withdrawal force
      • Durability
      • Nonoperating
    • Mechanical and Electrical performance

      • Mating Cycles
      • Rating current
      • Insulation resistance
      • Terminal contact resistance
      • Withstanding voltage
    • SPECIFICATIONS

      • VOLTAGE RATING 60V DC
      • CURRENT RATING 0.5A Max.(Each Pin)
      • INSULATION RESISTANCE 800MΩ MIN
      • CONTACT RESISTANCE 60mΩMAX
      • OPERATION TEMPERATURE -25°C~+85°C
      • Voltage
      • Dielectric Withstanding AC 500V
      • Durability
      • Total insertion force
      • Total extraction force
      • Contact Material Copper Alloy
      • Insulator Material Thermoplastic,UL94V-0
      • Plating Gold Plated.
      • Color
      • Max Processing Temp
      • DIELECTRIC WITHSTANDING VOLTAGE
      • INSERTION FORCE
      • WITHDRAWAL FORCE
      • DURABILITY
      • TEMPERATURE RANGE
      • MAX. PROCESSING TEMP
      • Rated voltage
      • Rated current
      • Withstand voltage
      • Working Temperature
      • Applicable Wire
      • Applicable PC board thickness
      • Housing material
      • Terminal material
      • Poles
      • Wafer Material
      • Applicable
      • pH
      • Pitch
    • ENVIRONMENTAL

      • TEMPERATURE RANGE
      • Housing
      • Contact
      • Shell
      • Operating Temperature
    • Mechanical properties

      • Insertion force
      • Extraction force
      • Life
    • Ratings

      • Rated current
      • Rated voltage
      • Operating temperature
      • Current Rating
      • Operating Voltage
      • Withstanding Voltage
      • Operating Temperature
    • Environmental performance

      • salt spray
      • OPERATING TEMPERATURE
    • NOTE

      • Plug insertion force
      • Durability
      • Insulation resistance
      • contact resistance
      • Withstanding voltage
      • rating current
      • Operating temperature
      • Storage temperature
      • Ambient Humidity Range
      • Housing
      • Insert
      • Shielding
      • Contact
    • Performance

      • Current rating
      • Contact resistance
      • Insulation resistance
      • Withstand voltage
      • Solderability
      • Retention force
      • Mating force
      • Un-mating force
      • life
      • Resistance to heat
      • Operating temperature
      • Rating current
      • Rating voltage
      • Temperature range
    • Electrical

      • Current Rating
      • Voltage Rating
      • Contact Resistance
      • Dielectric Withstanding Voltage
      • Insulation Resistance
    • Finishing

      • plating
      • Crimp Terminal
      • Shell
      • TERMINAL
      • SHELL COVER
    • Notes

      • Operation voltage
      • Contact resistance
      • Insulation resistance
      • Dielectric withstanding voltage
      • Operating Temperature
      • Insertion force
      • Removal force
      • Current rating
      • DURABILITY
      • CURRENT
      • VOLTAGE
      • OPERATION TEMPERATURE
      • MATERIAL
      • Finish
      • Wire range
    • MATERIAL SPECIFICATION

      • HOUSING
      • CONTACTS
      • MID PLATE
      • FRONT SHELL
      • MID PLATE&SPRING
      • FRONT SHELL&COVER
    • Material & Finish

      • Shell
      • Contact
    • RATING

      • CURRENT RATING
      • VOLTAGE RATING
      • TEMPERATURE RANGE
      • Operating Temperature
      • Rated Voltage
      • Rated Current
      • Withstanding Voltage
      • OPERATING VOLTAGE
      • OPERATING HUMIDITY RANGE
      • STORAGE TEMPERATURE RANGE
      • STORAGE HUMIDITY RANGE
    • Electrical and environment performance

      • Current rating
      • Voltage rating
      • Insulation resistance
      • Terminal contact resistance
      • Withstanding voltage
      • Operating temperature
      • Steady voltage
    • Material

      • Pin (outer sleeve)
      • Plating(outer sleeve)
      • Gold Plated
      • Insulator
      • Cllp(Contact 4 Flnger)
      • Mating pinΦ
      • Plating(Contact)
    • The product environmental requirements

      • Work temperature
    • SPBCIFICATIONS

      • Applicable
      • Voltage rating
      • Current rating
      • Withstand voltage
      • Working Temperature
      • Insulation resistance
      • Contact resistance
    • WAFER

      • Housing Material
      • Pin Material
      • Contact Area Plating

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