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Wafer1.25mm XP DIP 180°W=3.45 米色

Committed to providing stronger performance for the connector industry, industry users, and their professional connector applications

Category:

WAFER

Keywords: connectors

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Product Details

一、 Material and surface treatment of parts
1. Body: LCP UL94 V-0 black
2. Terminal: Plating of phosphor copper contact area and tin plating of solder legs
3. Shell: Stainless steel nickel plated, solder foot gold plated
4. Push rod: stainless steel

二、 Product characteristics
1. Ultra thin design, suitable for low height products
2. Terminal flying wing design to prevent kneeling PIN
3. Card holder type, push rod card retrieval design, convenient for users to use
4. The left and right Latches hold the card holders to increase the retention force and make the product more resistant to vibration
5. Suitable for working temperatures in various fields, with a working temperature range of -40 ℃ to+105 ℃

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