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Wafer 1.25 mm XP SMT horizontal placement with buckle, in reel packaging
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  • Wafer 1.25 mm XP SMT horizontal placement with buckle, in reel packaging

Wafer 1.25 mm XP SMT horizontal placement with buckle, in reel packaging

Category:

Wire-to-board Connector

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  • Product Introduction
  • 参数

    • Material

      • housing
      • orbit
      • Terminal
      • Shell

    • Electrical Characteristics

      • Operating voltage
      • Current rating
      • Operating Temperature
      • Insulation resistance
      • Dielectric withstanding voltage
      • Contact resistance

    • Mechanical characteristics

      • Mating durability
      • Insertion force
      • Extraction force
      • Mating cycle

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上一个： Wafer 1.25 mm XP, horizontal type, tin-plated with a matte finish, in roll form.

下一个： Wafer 1.25 mm XP DIP 90° H=3.45 Beige

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