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Wafer, 2.0 mm, XP DIP, 180°, with K‑shaped bends on both ends (0.8 mm), featuring a snap‑fit and positioning posts.
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  • Wafer, 2.0 mm, XP DIP, 180°, with K‑shaped bends on both ends (0.8 mm), featuring a snap‑fit and positioning posts.

Wafer, 2.0 mm, XP DIP, 180°, with K‑shaped bends on both ends (0.8 mm), featuring a snap‑fit and positioning posts.

Category:

Wire-to-board Connector

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  • Product Introduction
  • 参数
  • 1. Material and Surface Treatment of Components
    1. Body: PBT UL94 V-0, white
    2. Welding tabs: Brass, tin/gold plated
    II. Product Features

     

    1. Buckle‑mount design, suitable for high‑vibration environments
    2. Product with anti-misinsertion design
    3. The terminal pins are designed with an external K‑foot configuration, making them less likely to come loose during PCB assembly.
    5. Rated operating current: 3 A
    6. Suitable for a wide range of applications, with an operating temperature range of -25°C to +85°C.
    7. Expandable to 2–16 pins
    8. Compatible with the JST PA(B**B-PASK-1) series, DIP top-mount and side-mount types.

    • Material

      • housing
      • orbit
      • Terminal
      • Shell

    • Electrical Characteristics

      • Operating voltage
      • Current rating
      • Operating Temperature
      • Insulation resistance
      • Dielectric withstanding voltage
      • Contact resistance

    • Mechanical characteristics

      • Mating durability
      • Insertion force
      • Extraction force
      • Mating cycle

Keywords:

上一个： Wafer, 2.0 mm, XP DIP, 90°, with K‑shaped terminals on both sides, featuring a buckle and positioning posts, white, bagged.

下一个： Wafer 1.5 mm XP SMT vertical mounting, solderless pad

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